中国长鑫存储首次量产HBM3E芯片，缩小AI内存差距

China's CXMT makes its first HBM3E chips, closing the AI memory gap

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中国最大内存制造商长鑫存储（CXMT）首次小批量生产HBM3E芯片，该高速内存用于当前多款AI处理器。据The Information援引两位知情人士报道，阿里巴巴旗下平头哥和寒武纪正在测试该内存，计划2027年起在产品中使用。CXMT在技术上落后三星、SK海力士和美光三至五年，良率约25%，其上海IPO募资86亿美元但招股书未将资金用于HBM。

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China's top memory maker ChangXin Memory Technologies (CXMT) is producing HBM3E for the first time in small quantities, a fast memory found in many current AI processors. That's according to a report from The Information, citing two insiders. HBM (High Bandwidth Memory) consists of stacked memory chips placed right next to the processor, and it's needed to train and run large AI models.

That puts CXMT a generation behind Samsung, SK Hynix, and Micron, which are mass-producing HBM4. Alibaba's T-Head and Cambricon are testing the memory and plan to use it in products starting in 2027. That could lower one hurdle for China's own AI chips, since US export rules limit the purchase of advanced HBM chips.

According to The Information, CXMT is three to five years behind technically and struggles with low yields. SemiAnalysis estimated them at around 25 percent in June. In its Shanghai IPO, CXMT raised $8.6 billion, none of which is earmarked for HBM according to the prospectus.

The Information / CXMT HBM3E

SemiAnalysis / CXMT DRAM

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