Rohan Paul· @rohanpaul_ai · X·· 2026-08-28AI 评分48
AI 导读
SK海力士将在美国印第安纳州建设其首个高带宽内存（HBM）封装基地，总投资40亿美元。该基地占地133.5英亩，将接收韩国制造的晶圆进行封装测试，成品HBM供应美国客户。洁净室预计2028年10月启用，下一代HBM量产计划于2029年下半年开始，美国依据《芯片法案》提供最高4.58亿美元拨款及5亿美元贷款支持。
正文 · 原文
The U.S. is gaining SK hynix's first HBM packaging base in Indiana, a $4 B memory hub
The Indiana site will receive Korean-made wafers, package and test them, then ship finished HBM to U.S. customers.
a 133.5-acre site, will be SK Hynix’s first high-bandwidth memory packaging base in the US. Its cleanroom is expected to open by October 2028, with mass production of next-generation HBM scheduled to begin in the second half of 2029.
Washington is backing the build with up to $458M in grants and $500M in loans under the CHIPS Act.
来源：Rohan Paul · x.com